We can recommend 4-5 phr BYK®-P 9080 to you. This product was developed for low profile and class A SMC systems. It stabilizes the compound and improves flow behavior. Because of its excellent mold release properties in the tool, BYK®-P 9080 completely replaces the traditional mold release products. The additive improves the surface quality of the molded part. It also improves the paint adhesion and bondability.

Yes, BYK®-P 9065 was developed for LS SMC/BMC. Therefore, if you use 2-2.5 phr and remove the conventional mold release product, you will reduce the scrap rate. This is because of decreased shrinkage which will lead to less warpage, an increased gloss and reduced haze, and last but not least, improved color homogeneity and surface appearance of molded parts. Another benefit will be that there is no separation of the LS SMC/BMC compounds, which leads to reduced cobwebbing. No sanding is necessary after molding for parts to be painted or bonded. BYK®-P 9065 is fixed in the cured resin matrix and does not migrate to the surface of the finished parts.

Use 3-4 phr BYK®-P 9051 and remove the conventional mold release products from your formulation. BYK®-P 9051 is an additive to facilitate processing of BMC/DMC. It also has mold release properties. The product does not contribute to fogging. In BMC for headlamp reflectors, it minimizes fogging of the molded parts and is becoming a standard in the industry.

Basically, we have 2 wetting and dispersing additives. BYK®-W 9010 is solvent-free and contains 100% active substance for wetting and dispersing of fillers (and inorganic pigments) where solvents must be avoided. We also have BYK®-W 996. This is a universal and cost-effective wetting and dispersing additive for almost all applications. It is particularly effective in systems highly-filled with ATH. In your case since there is an extremely high amount, we can also recommend a combination of 1:1 (BYK®-W 996 : BYK®-W 9010). This is possible where high amounts of additive are required, as in your situation.