BYK Additives & Instruments

Additives for Floor Coatings: Solvent-borne Systems

BYK-054

Silicone-free defoamer on polymer-basis for solvent-borne and solvent-free systems, particularly polyurethane, epoxy coatings.

Compliant with FDA and/or EU food contact regulations. 
BYK-088

Defoamer based on silicones and polymers for solvent-free and solvent-borne coatings, printing inks, ambient curing plastic systems as well as adhesives and sealants. Aromatic-free.

Compliant with FDA and/or EU food contact regulations. 
BYK-307

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks and adhesive systems, with strong reduction of surface tension. Very good substrate wetting, prevents cratering, and increases surface slip. Solvent-free alternative to BYK-306.

Compliant with FDA and/or EU food contact regulations. 
BYK-333

Silicone-containing surface additive for solvent-free, solvent-borne and aqueous coating systems, printing inks and adhesive systems as well as ambient-curing plastic systems. Strong reduction of surface tension.

Compliant with FDA and/or EU food contact regulations. 
BYK-354

Polyacrylate-based surface additive for solvent-borne and solvent-free coatings, for UV-curing printing inks and overprint varnishes and ambient curing plastic systems. Standard leveling additive with a deaerating effect.

Compliant with FDA and/or EU food contact regulations. 
BYK-410

Liquid rheology additive for medium-polarity solvent-borne and solvent-free coating systems as well as PVC plastisols and ambient-curing resin systems. The additive creates highly thixotropic flow behavior and consequently improves the anti-sagging and anti-settling properties. Post-addition is possible.

Compliant with FDA and/or EU food contact regulations. 
BYK-1794

Emission-free and silicone-free polymeric defoamer for solvent-borne, solvent-free, high solids, and UV systems.

BYK-3550

Substrate wetting agent and leveling agent based on a silicone acrylate copolymer for solvent-borne coating systems. Strong reduction of the surface tension combined with very good recoatability.

BYK-7410 ET

Liquid rheology additive for medium-polarity solvent-borne and solvent-free coating systems as well as PVC plastisols and ambient-curing resin systems. The additive creates highly thixotropic flow behavior and consequently improves the anti-sagging and anti-settling properties. Post-addition is possible.


BYK-A 535

Silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

Compliant with FDA and/or EU food contact regulations. 

BYK-ES 80

Conductivity additive for solvent-borne, electrostatically-sprayed coating systems for increasing electrical conductivity.


BYK-P 104

Controlled flocculating wetting and dispersing additive for solvent-borne, medium-polarity to high-polarity coatings to prevent the flooding/floating of titanium dioxide in combination with colored pigments.

Compliant with FDA and/or EU food contact regulations. 

CERAFLOUR 929

Micronized, modified polyethylene wax for solvent-borne and aqueous coating systems for improving surface protection and for matting.

Compliant with FDA and/or EU food contact regulations. 
CERAFLOUR 970

Micronized polypropylene-based wax for solvent-borne coating systems and powder coatings to improve anti-slip properties and for matting.

Compliant with FDA and/or EU food contact regulations. 

DISPERBYK-111

Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings and printing inks for stabilizing inorganic pigments, in particular titanium dioxide. Strong reduction of millbase viscosity.

DISPERBYK-118

Wetting and dispersing additive for solvent-borne systems to stabilize acidic, neutral and basic titanium dioxides, colorful inorganic pigments, transparent iron oxides, fillers and effect pigments.

DISPERBYK-2055

100 % wetting and dispersing additive for solvent-borne, solvent-free, and aqueous cost-sensitive formulations.

DISPERBYK-2151

Highly branched wetting and dispersing additive for solvent-borne and solvent-free epoxides and other reactive systems.

DISPERBYK-2152

Emission-free, hyperbranched wetting and dispersing additive for solvent-free epoxy systems and other reactive systems; conforms to the German AgBB.

DISPERBYK-2155

VOC and solvent-free wetting and dispersing additive for solvent-borne and solvent-free coating systems, floor coatings, and printing inks. Particularly recommended for the manufacture of pigment concentrates with broad compatibility. The 100 % active substance makes it particularly suitable for high-solid and solvent-free systems.


GARAMITE-7305

Powdered rheology additive for polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.

Compliant with FDA and/or EU food contact regulations. 

TIXOGEL-MP 250

Rheology additive in powder form based on an organophilic phyllosilicate for polar to medium-polarity systems to generate thixotropic flow behavior.