BYK Additives & Instruments

Additives for Floor Coatings: Solvent-free systems

BYK-052 N

Silicone-free defoamer on polymer-basis for solvent-borne and solvent-free systems. Standard defoamer for many different applications.

Compliant with FDA and/or EU food contact regulations. 
BYK-054

Silicone-free defoamer on polymer-basis for solvent-borne and solvent-free systems, particularly polyurethane, epoxy coatings.

Compliant with FDA and/or EU food contact regulations. 
BYK-067 A

Silicone defoamer for solvent-free and solvent-borne printing inks and overprint varnishes as well as adhesives, sealants, and ambient curing plastic systems. Solvent-free version of BYK-066 N. Odorless.

BYK-088

Defoamer based on silicones and polymers for solvent-free and solvent-borne coatings, printing inks, ambient curing plastic systems as well as adhesives and sealants. Aromatic-free.

Compliant with FDA and/or EU food contact regulations. 
BYK-220 S

Wetting and dispersing additive for ambient-curing plastic systems and solvent-borne coatings to achieve pigment stabilization and to reduce flooding/floating. Contains silicone.

BYK-307

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks and adhesive systems, with strong reduction of surface tension. Very good substrate wetting, prevents cratering, and increases surface slip. Solvent-free alternative to BYK-306.

Compliant with FDA and/or EU food contact regulations. 
BYK-310

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks, adhesive systems and ambient-curing plastic systems with a strong reduction in the surface tension. Thermostable up to 210 °C.

Compliant with FDA and/or EU food contact regulations. 
BYK-320

Silicone-containing surface additive for solvent-borne coating systems with a slight reduction of surface tension and slight increase of surface slip. Good leveling with defoaming properties; also recommended for ambient curing plastic systems.

Compliant with FDA and/or EU food contact regulations. 
BYK-330

Silicone-containing surface additive with a strong reduction of surface tension of ambient-curing plastic systems. Improves substrate wetting and prevents surface defects.

Compliant with FDA and/or EU food contact regulations. 
BYK-333

Silicone-containing surface additive for solvent-free, solvent-borne and aqueous coating systems, printing inks and adhesive systems as well as ambient-curing plastic systems. Strong reduction of surface tension.

Compliant with FDA and/or EU food contact regulations. 
BYK-345

Silicone surfactant for aqueous coatings, printing inks and overprint varnishes with strong reduction in surface tension resulting in significantly improved substrate wetting. No increase in surface slip. Solvent-free version of BYK-346.

Compliant with FDA and/or EU food contact regulations. 
BYK-354

Polyacrylate-based surface additive for solvent-borne and solvent-free coatings, for UV-curing printing inks and overprint varnishes and ambient curing plastic systems. Standard leveling additive with a deaerating effect.

Compliant with FDA and/or EU food contact regulations. 
BYK-358 N

Surface additive on polyacrylate-basis for solvent-borne coating systems and printing inks. Standard leveling additive. No turbidity in clear coats and no haze in pigmented systems.

Compliant with FDA and/or EU food contact regulations. 
BYK-361 N

Polyacrylate-based surface additive for solvent-borne and solvent-free coatings, for UV-reactive printing inks and overprint varnishes as well as powder coatings. Improves leveling and prevents craters. Also suitable for ambient curing plastic systems. Solvent-free version of BYK-358 N.

Compliant with FDA and/or EU food contact regulations. 
BYK-370

Silicone-containing surface additive, polyester-modified, for solvent-borne coating systems and UP gel coats. OH-functional. Strongly reduces surface tension.

Compliant with FDA and/or EU food contact regulations. 
BYK-390

Surface additive on polyacrylate basis for solvent-borne systems. Prevents boiling marks in baking systems and has an air-releasing effect.

BYK-410

Liquid rheology additive for medium-polarity solvent-borne and solvent-free coating systems as well as PVC plastisols and ambient-curing resin systems. The additive creates highly thixotropic flow behavior and consequently improves the anti-sagging and anti-settling properties. Post-addition is possible.

Compliant with FDA and/or EU food contact regulations. 
BYK-1790

Silicone-free, polymer-based defoamer for solvent-free, radiation-curing wood and industrial coatings, printing inks and adhesives. Suitable for pigmented and unpigmented coating systems.

Compliant with FDA and/or EU food contact regulations. 
BYK-1791

Aromatic-free, polymer-based defoamer (silicone-free) for radiation-curing systems (wood and industrial coatings, printing inks and adhesives) that has a spontaneous defoaming effect as well as high transparency and low cratering tendency.

Compliant with FDA and/or EU food contact regulations. 
BYK-1794

Emission-free and silicone-free polymeric defoamer for solvent-borne, solvent-free, high solids, and UV systems.

BYK-1798

Silicone-containing defoamer for aqueous and radiation-curable systems.

BYK-3550

Substrate wetting agent and leveling agent based on a silicone acrylate copolymer for solvent-borne coating systems. Strong reduction of the surface tension combined with very good recoatability.

BYK-7410 ET

Liquid rheology additive for medium-polarity solvent-borne and solvent-free coating systems as well as PVC plastisols and ambient-curing resin systems. The additive creates highly thixotropic flow behavior and consequently improves the anti-sagging and anti-settling properties. Post-addition is possible.


BYK-A 530

Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants. Particularly recommended for epoxy resin systems.

BYK-A 535

Silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

Compliant with FDA and/or EU food contact regulations. 

BYK-ES 80

Conductivity additive for solvent-borne, electrostatically-sprayed coating systems for increasing electrical conductivity.


BYK-P 104

Controlled flocculating wetting and dispersing additive for solvent-borne, medium-polarity to high-polarity coatings to prevent the flooding/floating of titanium dioxide in combination with colored pigments.

Compliant with FDA and/or EU food contact regulations. 
BYK-P 105

Controlled flocculating wetting and dispersing additive for solvent-borne and solvent-free adhesives as well as ambient-curing resin systems to stabilize fillers. Solvent-free version
of BYK-P 104.

Compliant with FDA and/or EU food contact regulations. 

BYK-UV 3500

Crosslinking, silicone-containing surface additive for radiation-curable printing inks, coatings and adhesives with a considerable reduction in surface tension. Very good substrate wetting and tape release, increases the surface slip and improves leveling.


BYK-W 940

Wetting and dispersing additive for mineral fillers in unsaturated resin systems and adhesives. The additive prevents the flooding/floating and settling of pigments and fillers in epoxy and VE/UP-based laminates. Reduction in the flooding/floating of colored pigments in gel coats.

Compliant with FDA and/or EU food contact regulations. 
BYK-W 969

Wetting and dispersing additive for amide accelerated UP, EP, PUR systems and adhesives to reduce viscosity in mineral-filled systems. Embedded into the polymer matrix due to their OH functionality. Prolonged gelling time in cobalt-accelerated UP resins.

BYK-W 980

Wetting and dispersing additive to reduce viscosity and prevent fi llers from settling in ambient curing resin systems and adhesives as well as for polyester molding compounds, wet mat molding and pultrusion applications

Compliant with FDA and/or EU food contact regulations. 

DISPERBYK-111

Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings and printing inks for stabilizing inorganic pigments, in particular titanium dioxide. Strong reduction of millbase viscosity.

DISPERBYK-118

Wetting and dispersing additive for solvent-borne systems to stabilize acidic, neutral and basic titanium dioxides, colorful inorganic pigments, transparent iron oxides, fillers and effect pigments.

DISPERBYK-163

Wetting and dispersing additive for solvent-borne coatings and pigment concentrates. Stabilizes pigments of all types. Broad compatibility for all-purpose solvent-borne pigment concentrates on the basis of aldehyde and acrylate grinding resins.

DISPERBYK-180

Solvent-free wetting and dispersing additive for solvent-borne, solvent-free and aqueous coating systems, printing inks and adhesives for stabilizing inorganic pigments, in particular titanium dioxide.

DISPERBYK-2013

Solvent-free wetting and dispersing additive for 100 % UV systems and solvent-borne and water-borne UV systems for printing inks and coatings.

DISPERBYK-2055

100 % wetting and dispersing additive for solvent-borne, solvent-free, and aqueous cost-sensitive formulations.

DISPERBYK-2151

Highly branched wetting and dispersing additive for solvent-borne and solvent-free epoxides and other reactive systems.

DISPERBYK-2152

Emission-free, hyperbranched wetting and dispersing additive for solvent-free epoxy systems and other reactive systems; conforms to the German AgBB.

DISPERBYK-2155

VOC and solvent-free wetting and dispersing additive for solvent-borne and solvent-free coating systems, floor coatings, and printing inks. Particularly recommended for the manufacture of pigment concentrates with broad compatibility. The 100 % active substance makes it particularly suitable for high-solid and solvent-free systems.


GARAMITE-7305

Powdered rheology additive for polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.

Compliant with FDA and/or EU food contact regulations. 

TIXOGEL-MP 250

Rheology additive in powder form based on an organophilic phyllosilicate for polar to medium-polarity systems to generate thixotropic flow behavior.