BYK

Additives for Adhesives & Sealants: Solvent-borne, solvent-free

BYK-067 A

Silicone defoamer for solvent-free and solvent-borne printing inks and overprint varnishes as well as adhesives, sealants, and ambient curing plastic systems. Solvent-free version of BYK-066 N. Odorless.

BYK-088

Defoamer based on silicones and polymers for solvent-free and solvent-borne coatings, printing inks, ambient curing plastic systems as well as adhesives and sealants. Aromatic-free.

BYK-307

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks and adhesive systems, with strong reduction of surface tension. Very good substrate wetting, prevents cratering, and increases surface slip. Solvent-free alternative to BYK-306.

BYK-310

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks, adhesive systems and ambient-curing plastic systems with a strong reduction in the surface tension. Thermostable up to 210 °C.

BYK-333

Silicone-containing surface additive for solvent-free, solvent-borne and aqueous coating systems, printing inks and adhesive systems as well as ambient-curing plastic systems. Strong reduction of surface tension.

BYK-378

Solvent-free silicone surface additive for water-borne, solvent-borne, and solvent-free systems that increases surface slip and significantly reduces the surface tension at low doses. Low foam stabilization.

BYK-1794

Emission-free and silicone-free polymeric defoamer for solvent-borne, solvent-free, high solids, and UV systems.

BYK-9076

Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings, adhesives, PVC plastisols, ambient curing resin systems, and for the production of color masterbatches for thermoplastics. Particularly recommended for carbon black pigments. Prevents separation and improves the fiber wetting in SMC/BMC formulations.


BYK-A 515

Silicone-free polymer-based air release agent for solvent-borne and solvent-free epoxy, UP/VE and PUR systems and adhesives. Improves the fiber wetting and is particularly used in vinyl ester resins, highly thixotropic gel coats and acrylate resins (syrups).

BYK-A 525

Defoamer/air release agent for potting compounds, sealants and adhesives (polyurethane and epoxy). Contains silicone.

BYK-A 530

Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants. Particularly recommended for epoxy resin systems.

BYK-A 535

Silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

BYK-A 550

Silicone-free air-release additive for solvent-free and solvent-borne UP systems and adhesives. Excellent air release qualities with a minor tendency for turbidity in unsaturated polyester resins. Particularly suitable for transparent systems.


BYK-P 105

Controlled flocculating wetting and dispersing additive for solvent-borne and solvent-free adhesives as well as ambient-curing resin systems to stabilize fillers. Solvent-free version
of BYK-P 104.


BYK-W 940

Wetting and dispersing additive for mineral fillers in unsaturated resin systems and adhesives. The additive prevents the flooding/floating and settling of pigments and fillers in epoxy and VE/UP-based laminates. Reduction in the flooding/floating of colored pigments in gel coats.

BYK-W 961

Wetting and dispersing additive against settling in ambient curing resin systems. Specifically for mineral-filled PU systems.

BYK-W 966

Wetting and dispersing additive for filled unsaturated polyester resins as well as acrylic, PU and epoxy resins to reduce viscosity and prevent settling. For fiber reinforced spray-up and hand lay-up resins, adhesives and cobalt-accelerated putty compounds. Aromatic-free solution of ANTI-TERRA-U 100.

BYK-W 969

Wetting and dispersing additive for amide accelerated UP, EP, PUR systems and adhesives to reduce viscosity in mineral-filled systems. Embedded into the polymer matrix due to their OH functionality. Prolonged gelling time in cobalt-accelerated UP resins.

BYK-W 980

Wetting and dispersing additive to reduce viscosity and prevent fi llers from settling in ambient curing resin systems and adhesives as well as for polyester molding compounds, wet mat molding and pultrusion applications

BYK-W 985

Wetting and dispersing additive for ambient-curing resin systems and adhesives to reduce the viscosity in mineral-filled systems.

BYK-W 996

Wetting and dispersing additive for filled, unsaturated polyester systems and epoxy systems.

BYK-W 9010

Wetting and dispersing additive for filled, unsaturated polyester systems and epoxy systems.


DISPERBYK-118

Wetting and dispersing additive for solvent-borne systems to stabilize acidic, neutral and basic titanium dioxides, colorful inorganic pigments, transparent iron oxides, fillers and effect pigments.

DISPERBYK-2152

Emission-free, hyperbranched wetting and dispersing additive for solvent-free epoxy systems and other reactive systems; conforms to the German AgBB.


GARAMITE-1958

Powdered rheology additive based on organophilic phyllosilicates for solvent-borne and solvent-free systems to increase the storage stability and sag resistance.

GARAMITE-7303

Powdered rheology additive for non-polar to medium-polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.

GARAMITE-7305

Powdered rheology additive for polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.


RHEOBYK-430

Liquid rheology additive for solvent-borne coatings, adhesives, and sealants to improve anti-sagging and anti-settling properties.

RHEOBYK-431

Liquid rheology additive for solvent-borne coatings, adhesives, and sealants to improve anti-sagging and anti-settling properties.

RHEOBYK-7410 ET

Liquid rheology additive to generate highly thixotropic flow behavior for medium-polarity solvent-borne and solvent-free systems.

RHEOBYK-R 605

Liquid rheology additive for plastic applications such as vinyl ester and epoxy resins, unsaturated polyester resins, and gel coats to reinforce the rheological effectiveness of pyrogenic silica.

Incorporation of the fumed silica is made easier, separation is prevented, and the thixotropic behavior increased or stabilized.

RHEOBYK-R 606

Liquid rheology additive for solvent-borne and solvent-free adhesives and sealants based on polyurethane, epoxy, and acrylate resins that contain pyrogenic silica or organophilic phyllosilicates.

RHEOBYK-R 607

Rheology additive for solvent-free and solvent-borne systems to enhance the rheological properties in conjunction with hydrophilic fumed silica and clay additives.