BYK

Additives for Floor Coatings: Solvent-free systems

ANTI-TERRA-204

Controlled flocculating wetting and dispersing additive for solvent-borne medium-polar to non-polar thick layer systems and primers to prevent fillers and inorganic pigments from settling and to gel bentonites.


BYK-054

Silicone-free defoamer on polymer-basis for solvent-borne and solvent-free systems, particularly polyurethane, epoxy coatings.

BYK-066 N

Silicone defoamer for solvent-free and solvent-borne coatings, printing inks, and ambient curing plastic systems on the basis of epoxy resin and polyurethane. Standard silicone defoamer for all solvent-borne systems. Good balance between effectiveness and compatibility.

BYK-088

Defoamer based on silicones and polymers for solvent-free and solvent-borne coatings, printing inks, ambient curing plastic systems as well as adhesives and sealants. Aromatic-free.

BYK-220 S

Wetting and dispersing additive for ambient-curing plastic systems and solvent-borne coatings to achieve pigment stabilization and to reduce flooding/floating. Contains silicone.

BYK-310

Silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks, adhesive systems and ambient-curing plastic systems with a strong reduction in the surface tension. Thermostable up to 210 °C.

BYK-315 N

Silicone-containing surface additive for solvent-borne coating systems, in particular automotive coatings. Slight reduction in the surface tension and slight increase in surface slip. No blushing after water immersion test.

BYK-315 N replaces BYK-315.

BYK-320

Silicone-containing surface additive for solvent-borne coating systems with a slight reduction of surface tension and slight increase of surface slip. Good leveling with defoaming properties; also recommended for ambient curing plastic systems.

BYK-326

Silicone-containing surface additive for solvent-borne, aqueous, and 100 % coatings with a slight reduction in surface tension and a slight increase in surface slip. Particularly suitable for good leveling.
 

BYK-330

Silicone-containing surface additive with a strong reduction of surface tension of ambient-curing plastic systems. Improves substrate wetting and prevents surface defects.

BYK-333

Silicone-containing surface additive for solvent-free, solvent-borne and aqueous coating systems, printing inks and adhesive systems as well as ambient-curing plastic systems. Strong reduction of surface tension.

BYK-354

Polyacrylate-based surface additive for solvent-borne and solvent-free coatings, for UV-curing printing inks and overprint varnishes and ambient curing plastic systems. Standard leveling additive with a deaerating effect.

BYK-358 N

Surface additive on polyacrylate-basis for solvent-borne coating systems and printing inks. Standard leveling additive. No turbidity in clear coats and no haze in pigmented systems.

BYK-370

Silicone-containing surface additive, polyester-modified, for solvent-borne coating systems and UP gel coats. OH-functional. Strongly reduces surface tension.

BYK-378

Solvent-free silicone surface additive for water-borne, solvent-borne, and solvent-free systems that increases surface slip and significantly reduces the surface tension at low doses. Low foam stabilization.

BYK-390

Surface additive on polyacrylate basis for solvent-borne systems. Prevents boiling marks in baking systems and has an air-releasing effect.

BYK-392

Surface additive on polyacrylate basis for solvent-borne baking systems. Promotes leveling, has a spontaneous defoaming effect (particularly for microfoam), and is effective for very short baking times. Suitable for roller application, conventional spraying application, and airless/airmix applications.

BYK-1790

Silicone-free, polymer-based defoamer for solvent-free, radiation-curing wood and industrial coatings, printing inks and adhesives. Suitable for pigmented and unpigmented coating systems.

BYK-1794

Emission-free and silicone-free polymeric defoamer for solvent-borne, solvent-free, high solids, and UV systems.

BYK-1795

Silicone-free polymer defoamer for solvent-borne, solvent-free and radiation-curable systems.

BYK-3440

Surface additive for solvent-borne, solvent-free and aqueous systems with a strong reduction in the surface tension. Good wetting of critical substrates. No influence on surface slip.

BYK-3550

Substrate wetting agent and leveling agent based on a silicone acrylate copolymer for solvent-borne coating systems. Strong reduction of the surface tension combined with very good recoatability.

BYK-9076

Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings, adhesives, PVC plastisols, ambient curing resin systems, and for the production of color masterbatches for thermoplastics. Particularly recommended for carbon black pigments. Prevents separation and improves the fiber wetting in SMC/BMC formulations.


BYK-A 530

Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants. Particularly recommended for epoxy resin systems.


BYK-ES 80

Conductivity additive for solvent-borne, electrostatically-sprayed coating systems for increasing electrical conductivity.


BYK-P 104 S

Controlled flocculating wetting and dispersing additive for solvent-borne, medium-polarity to high-polarity coatings to prevent the flooding/floating of titanium dioxide in combination with
colored pigments. Contains silicone to improve flooding/floating behavior.

BYK-P 9920

Additive for improving the fiber wetting in composites.


BYK-W 940

Wetting and dispersing additive for mineral fillers in unsaturated resin systems and adhesives. The additive prevents the flooding/floating and settling of pigments and fillers in epoxy and VE/UP-based laminates. Reduction in the flooding/floating of colored pigments in gel coats.

BYK-W 969

Wetting and dispersing additive for amide accelerated UP, EP, PUR systems and adhesives to reduce viscosity in mineral-filled systems. Embedded into the polymer matrix due to their OH functionality. Prolonged gelling time in cobalt-accelerated UP resins.

BYK-W 980

Wetting and dispersing additive to reduce viscosity and prevent fi llers from settling in ambient curing resin systems and adhesives as well as for polyester molding compounds, wet mat molding and pultrusion applications


CERAFLOUR 929 N

Micronized, modified polyethylene wax for solvent-borne and aqueous coating systems for improving surface protection and for matting.

CERAFLOUR 970

Micronized polypropylene-based wax for solvent-borne coating systems and powder coatings to improve anti-slip properties and for matting.


CERAMAT 258

Wax dispersion based on an oxidized HDPE wax for solvent-borne coatings to improve the scratch resistance, for matting and to generate a soft-feel effect.


DISPERBYK-110

Wetting and dispersing additive for solvent-borne and solvent-free coatings and printing inks for stabilizing inorganic pigments, in particular titanium dioxide. Strong reduction of millbase viscosity.

DISPERBYK-111

Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings and printing inks for stabilizing inorganic pigments, in particular titanium dioxide. Strong reduction of millbase viscosity.

DISPERBYK-180

Solvent-free wetting and dispersing additive for solvent-borne, solvent-free and aqueous coating systems, printing inks and adhesives for stabilizing inorganic pigments, in particular titanium dioxide.

DISPERBYK-2013

Solvent-free wetting and dispersing additive for 100 % UV systems and solvent-borne and water-borne UV systems for printing inks and coatings.

DISPERBYK-2152

Emission-free, hyperbranched wetting and dispersing additive for solvent-free epoxy systems and other reactive systems; conforms to the German AgBB.

DISPERBYK-2155

VOC and solvent-free wetting and dispersing additive for solvent-borne and solvent-free coating systems, floor coatings, and printing inks. Particularly recommended for the manufacture of pigment concentrates with broad compatibility. The 100 % active substance makes it particularly suitable for high-solid and solvent-free systems.


GARAMITE-7303

Powdered rheology additive for non-polar to medium-polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.

GARAMITE-7305

Powdered rheology additive for polar solvent-borne and solvent-free systems to increase the storage stability and sag resistance.


RHEOBYK-430

Liquid rheology additive for solvent-borne coatings, adhesives, and sealants to improve anti-sagging and anti-settling properties.

RHEOBYK-7410 ET

Liquid rheology additive to generate highly thixotropic flow behavior for medium-polarity solvent-borne and solvent-free systems.