BYK-A 526 Cumene-free, silicone-containing air release agent for potting compounds and sealants. Suitable for polyurethane or epoxy systems 新
BYK-A 560 N Silicone-free air release additive for solvent-based and solvent-free UP systems with additional improvement of fiber wetting 新
CERAFLOUR 924 Micronized wax for aqueous and solvent-borne systems, especially for soft touch properties and heat-sealing applications 新
PURABYK-R 5530 Liquid rheology additive to create a thixotropic flow behavior in aqueous and polar solvent-based systems. 新
PURABYK-R 5531 Liquid rheology additive to create a thixotropic flow behavior in aqueous and polar solvent-based systems. 新
BYKUMEN N Wetting and dispersing additive for solvent-borne systems to prevent fillers and inorganic pigments from settling 新
BYK-A 516 Silicone- and aromatic-free, polymer-based air release additive for solvent-borne and solvent-free thermoset applications 新